PCN-Product Change Notice & Application Note
 

 *Discontinue for TO-3 package products.  
 *Discontinue for XL1225 series products.  
 *Discontinue for UD40302 devive.  
 *Implement alternative carrier of TO-252 package.  
 *Al wire diameter change on 1NXX/2NXX/3NXX series devices.  
 *AuPdCu wire process implement for wire diameter<φ27um specific package.  
 *Implement alternative Lead frame of TSSOP-8 package.  
 *Cu wire process implemant for U74LVC1G125G SOT-353.  
 *Tube quantity changes of SOP-16W package.  
 *Implement alternative mold of TO-220 package.  
 *Implement alternative Taping and Reel of SOP-28 package.  
 *Marking change for U74AUP1GXX devices.  
 *Add antistatic tube on DIP-18 package source.  
 *Implement alternative mold of TO-220F package.  
 *Datasheet Change of 2N60-C.  
 *Change molding compound in P/N LD1117AL TO-252.  
 *TO-252 Cover Tape.  
 *Copper Wire process implement in TO-220_LM78XX  
 *Copper Wire process implement in TO-252_LD1117AG.  
 *Copper Wire process implement in TO-92_TL431K.  
 *xN60 MOSFET Part Number Change.  
 *xN60 MOSFET Ordering Number Change.  
 *Notification of process change from Eutectic to Soft-solder in partial of SOT-89
     devices.
 
 *Notification of process change from Conductive epoxy to soft-solder in partial of SOT-
     89 devices.
 
 *Mounting application note.  
 *Marking Rule Change of DFN.  
 *LR1108G SOT-25 Separate into LR1108G/LR1108EG.  
 *Add carrier tape on TO-92 package source.  
 *Discontinue Non-halogen Free Packages.  
 *Label format change.  
 *Switch the SOT-23 package in Transistor to JEDEC TO-236 from MO-178AA.  
 *Marking Rule Change of TO-126/TO-126C/TO-126S/TO-92NL.  
 *Datasheet Change of MMDT2227.  
 *Datasheet Change of 2N60-E.  
 *Alternate Lead frame of SOP-8.  
 *Adjusting IDSS and top marking code of TF2123(Marking Change).  
 *UTC phased out GEJIU Tin ball for plating on leads surface.  
 *Adjusting the ITSM of US108S/N.  
 *Adjusting the test condition of QG、QGD and QGS of UF9Z24.  
 *Adjusting the typical value of tD(ON) and the test condition of IAS for 6N60.  
 *Conversion of Gold wire to Copper wire in selected UTC's products.  
 *Change Device Tape Orientation In SOT-25 Taping Reel.  
 *Rotate The Marking Orientation Of SOT-25 Device.  
 *Product Label format change with Barcode  
 *Change marking code of Halogen-free products that marked in IC body from “L” to “G”  
 *Copper Wire in the SOT-23 package for POWER MOSFET Products.  
 *New Label To Halogen Free products.  
 *Copper Wire in the SOT-23 package for TRANSISTOR Products.